Vesicular ceramic vacuum chuck tables ( Porous ceramic vacuum chuck table ) are widely used for Dicing Saw, Laser Dicing, Laser marketing, Grooving, Wafer back grinding and Wafer mounting which requires high degree of parallelism. Our precision machining capability is worldly approved by semi conductor industry
Round ,rectangular and custom size available.
* Different specifications can be manufactured per request,repair service also available.
Size
|
Parallelism
|
4 ˝
|
2 ㎛
|
6 ˝
|
3 ㎛
|
8 ˝
|
5 ㎛
|
12 ˝
|
5 ㎛,
|
* Different specifications can be manufactured per request,repair service also available.
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